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Zure kokapena zerrendatuta ez badago, hautatu hauetako bat:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Hasiera
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  5. K3UH7H70AM-EGCL

Samsung Semiconductor - K3UH7H70AM-EGCL

KEY Part #: K7359733

[19657piezak Stock]

    Taldea zenbakia:
    K3UH7H70AM-EGCL
    fabrikatzailea:
    Samsung Semiconductor
    Deskribapen zehatza:
    64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.
    Fabrikatzailearen denbora beruna:
    Badago
    Bizimodua:
    Urte bat
    Chip From:
    Hong Kong
    RoHS:
    Ordaintzeko modua:
    Bidalketa modua:
    Familia Kategoriak:
    KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: LPDDR4, HBM Aquabolt, LPDDR3, DDR4, HBM Flarebolt, MODULE, DDR3 and GDDR5 ...
    Abantaila lehiakorra:
    We specialize in Samsung Semiconductor K3UH7H70AM-EGCL electronic components. K3UH7H70AM-EGCL can be shipped within 24 hours after order. If you have any demands for K3UH7H70AM-EGCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K3UH7H70AM-EGCL Produktuen atributuak

    Taldea zenbakia : K3UH7H70AM-EGCL
    fabrikatzailea : Samsung Semiconductor
    deskribapena : 64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production
    Series : DDR3
    dentsitatea : 64 Gb
    Org. : x64
    Abiadura : 4266 Mbps
    Tentsioa : 1.8 / 1.1 / 0.6 V
    Aldi baterako. : -25 ~ 85 °C
    Package : 376FBGA
    Produktuen Status : Mass Production

    Azken berriak

    5G and Memory - from Connected Thinking to Connected Living
    Samsung Showcases Its Latest Silicon Technologies for the Next Wave of Innovation at Annual Tech Day
    [Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones
    Mission Peak Reference Server System for NGSFF SSD
    Autonomous Driving and the Quest for Safety
    Bringing Artificial Intelligence to Devices Everywhere
    NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters
    How Will 5G Impact on Memory?
    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Samsung Z-SSD SZ985
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