Samsung Semiconductor - K4B2G1646F-BYNB

KEY Part #: K7359666

[19090piezak Stock]


    Taldea zenbakia:
    K4B2G1646F-BYNB
    fabrikatzailea:
    Samsung Semiconductor
    Deskribapen zehatza:
    2 Gb 128M x 16 2133 Mbps 1.35 V 0 ~ 85 °C 96FBGA Mass Production.
    Fabrikatzailearen denbora beruna:
    Badago
    Bizimodua:
    Urte bat
    Chip From:
    Hong Kong
    RoHS:
    Ordaintzeko modua:
    Bidalketa modua:
    Familia Kategoriak:
    KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: HBM Flarebolt, DDR4, LPDDR5, MODULE, LPDDR3, HBM Aquabolt, SLC Nand and LPDDR4X ...
    Abantaila lehiakorra:
    We specialize in Samsung Semiconductor K4B2G1646F-BYNB electronic components. K4B2G1646F-BYNB can be shipped within 24 hours after order. If you have any demands for K4B2G1646F-BYNB, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4B2G1646F-BYNB Produktuen atributuak

    Taldea zenbakia : K4B2G1646F-BYNB
    fabrikatzailea : Samsung Semiconductor
    deskribapena : 2 Gb 128M x 16 2133 Mbps 1.35 V 0 ~ 85 °C 96FBGA Mass Production
    Series : DDR3
    dentsitatea : 2 Gb
    Org. : 128M x 16
    Abiadura : 2133 Mbps
    Tentsioa : 1.35 V
    Aldi baterako. : 0 ~ 85 °C
    Package : 96FBGA
    Produktuen Status : Mass Production

    Era berean, interesatuko zaizu
    • K3UH5H50AM-AGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    • K3UH5H50AM-EGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH5H50AM-JGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 432FBGA Mass Production.

    • K3UH6H60BM-AGCL

      Samsung Semiconductor

      48 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    • K3UH6H60BM-EGCL

      Samsung Semiconductor

      48 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH7H70AM-AGCL

      Samsung Semiconductor

      64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.