CTS Thermal Management Products - BDN11-3CB/A01

KEY Part #: K6265518

BDN11-3CB/A01 Prezioak (USD) [34131piezak Stock]

  • 1 pcs$1.24277
  • 10 pcs$1.21104
  • 25 pcs$1.17843
  • 50 pcs$1.05579
  • 100 pcs$0.99370
  • 250 pcs$0.93161
  • 500 pcs$0.90055
  • 1,000 pcs$0.80739
  • 5,000 pcs$0.79186

Taldea zenbakia:
BDN11-3CB/A01
fabrikatzailea:
CTS Thermal Management Products
Deskribapen zehatza:
HEATSINK CPU W/ADHESIVE 1.11SQ.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Zaleak - Osagarriak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Modulu termikoak - Termoelektrikoak, Peltier, Termikoak - Bero Hodiak, Lurrun Ganberak, Termikoak - Kuxinak, xaflak, Termikoa - Likidoak Hoztea, Zaleak and Termikoak - Bero-konketa ...
Abantaila lehiakorra:
We specialize in CTS Thermal Management Products BDN11-3CB/A01 electronic components. BDN11-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN11-3CB/A01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN11-3CB/A01 Produktuen atributuak

Taldea zenbakia : BDN11-3CB/A01
fabrikatzailea : CTS Thermal Management Products
deskribapena : HEATSINK CPU W/ADHESIVE 1.11SQ
Series : BDN
Taldearen egoera : Active
Mota : Top Mount
Paketea hoztu da : Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa : Thermal Tape, Adhesive (Included)
forma : Square, Pin Fins
Luzera : 1.110" (28.19mm)
Zabalera : 1.110" (28.19mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 0.355" (9.02mm)
Potentzia xahutzea @ tenperatura igoera : -
Erresistentzia termikoa @ Aire Fluxu behartua : 7.20°C/W @ 400 LFM
Erresistentzia termikoa @ Naturala : 20.90°C/W
Material : Aluminum
Materialaren akabera : Black Anodized

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