ATS-X53210G-C1-R0 Prezioak (USD) [5670piezak Stock]
- 1 pcs$7.28036
- 10 pcs$6.87756
- 25 pcs$6.47300
- 50 pcs$6.06844
- Taldea zenbakia:
- ATS-X53210G-C1-R0
- fabrikatzailea:
- Advanced Thermal Solutions Inc.
- Deskribapen zehatza:
- SUPERGRIP HEATSINK 21X21X12.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 21x21x12.5mm
- Fabrikatzailearen denbora beruna:
- Badago
- Bizimodua:
- Urte bat
- Chip From:
- Hong Kong
- RoHS:
- Ordaintzeko modua:
-
- Bidalketa modua:
- Familia Kategoriak:
- KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoa - Osagarriak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Bero-konketa, Zaleak, Termikoa - Likidoak Hoztea, Termikoak - Bero Hodiak, Lurrun Ganberak, Termikoak - Termoelektrikoak, Peltier multzoak and Termikoak - Itsasgarriak, epoxiak, koipeak, itsats ...
- Abantaila lehiakorra:
- We specialize in Advanced Thermal Solutions Inc. ATS-X53210G-C1-R0 electronic components. ATS-X53210G-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53210G-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-X53210G-C1-R0 Produktuen atributuak
Taldea zenbakia :
ATS-X53210G-C1-R0
fabrikatzailea :
Advanced Thermal Solutions Inc.
deskribapena :
SUPERGRIP HEATSINK 21X21X12.5MM
Series :
superGRIP™
Taldearen egoera :
Active
Mota :
Top Mount
Paketea hoztu da :
BGA
Eranskineko metodoa :
Clip, Thermal Material
forma :
Square, Fins
Luzera :
0.827" (21.00mm)
Zabalera :
0.827" (21.00mm)
diametroa :
-
Altuera Itxi Oinarria (Altueraren altuera) :
0.492" (12.50mm)
Potentzia xahutzea @ tenperatura igoera :
-
Erresistentzia termikoa @ Aire Fluxu behartua :
11.10°C/W @ 200 LFM
Erresistentzia termikoa @ Naturala :
-
Material :
Aluminum
Materialaren akabera :
Blue Anodized
Azken berriak
Era berean, interesatuko zaizu
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
Pieza beroak
- 328990006
- FXE827269T710
- ATS-61270W-C1-R0
- 8-1542003-8
- 5-1542007-8
- 8-1542001-7
- 811102B00000
- 831302B00000
- 825502B02853
- TXP1808ND
- VHS-95
- MHST02525
- APR38-38-12CB/M
- 647-10ABP
- LA363B3CB
- HP1-TO3-CB
- 7-374-2-BA
- PSD1-2-CB
- 7-444-01E-BA
- 7-309-BA
- 7-198-BA
- PVC-1B
- RUR671U
- 2-1963562-4
- 1-1963562-2
- 2-1963558-5
- 2-1963554-4
- 2-1963556-5
- 1-1963552-4
- 1-1963551-4
- 2-1963555-3
- 1-1963554-3
- 1-1963552-5
- 5-1961000-0
- 39880100110
- 2-1542006-0
- TXBF2-050-033U
- APR33-33-12CB/M
- 634-10ABP
- 4-1542012-6