DC0011/06-TI900-0.12-2A Prezioak (USD) [164072piezak Stock]
- 1 pcs$0.22543
- 10 pcs$0.21397
- 25 pcs$0.20313
- 50 pcs$0.19783
- 100 pcs$0.19518
- 250 pcs$0.18180
- 500 pcs$0.17111
- 1,000 pcs$0.15507
- 5,000 pcs$0.14972
- Taldea zenbakia:
- DC0011/06-TI900-0.12-2A
- fabrikatzailea:
- t-Global Technology
- Deskribapen zehatza:
- THERM PAD 18.03MMX12.7MM W/ADH.
- Fabrikatzailearen denbora beruna:
- Badago
- Bizimodua:
- Urte bat
- Chip From:
- Hong Kong
- RoHS:
- Ordaintzeko modua:
-
- Bidalketa modua:
- Familia Kategoriak:
- KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Zaleak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Termoelektrikoak, Peltier multzoak, Modulu termikoak - Termoelektrikoak, Peltier, DC Zaleak, Termikoa - Likidoak Hoztea, Termikoak - Bero Hodiak, Lurrun Ganberak and Termikoak - Bero-konketa ...
- Abantaila lehiakorra:
- We specialize in t-Global Technology DC0011/06-TI900-0.12-2A electronic components. DC0011/06-TI900-0.12-2A can be shipped within 24 hours after order. If you have any demands for DC0011/06-TI900-0.12-2A, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DC0011/06-TI900-0.12-2A Produktuen atributuak
Taldea zenbakia :
DC0011/06-TI900-0.12-2A
fabrikatzailea :
t-Global Technology
deskribapena :
THERM PAD 18.03MMX12.7MM W/ADH
Series :
Ti900
Taldearen egoera :
Active
Usage :
TO-220
Mota :
Die-Cut Pad, Sheet
forma :
Rectangular
eskema :
18.03mm x 12.70mm
Lodiera :
0.0050" (0.127mm)
Material :
Silicone
Atxikidura :
Adhesive - Both Sides
Babeslea, garraiolaria :
Viscose
Kolore :
White
Erresistentzia termikoa :
-
Eroankortasun termikoa :
1.8 W/m-K
Azken berriak
Era berean, interesatuko zaizu
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-264
Wakefield-Vette
THERM PAD 26.67MMX21.59MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-264 Pad, 0.003 Inch Thick
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Pieza beroak
- A15796-22
- A16006-08
- A15896-31
- A14574-01
- A14570-01
- GPHC3.0-0.080-02-0816
- A14566-01
- A14950-09
- A14950-06
- A14557-01
- T69-225-225-0.025-1A
- 5519S-2MIL
- PC99-107.95-61.98-0.06
- A14162-42
- A14162-24
- DC0036/03-PC99AL-0.1
- DC0036/02-PC99-0.06
- DC0038/07-PC99-0.06
- TG4040S-150-150-3.0-0
- TG4040S-100-100-2.0-0
- TG2030S-100-100-5.0-0
- PC94-100-100-0.25-0
- TGX-2-320-320-1.5
- PC93-10-5-0.25
- PC93-10-10-0.25
- 100MM-1M-5515-20
- A15673-20
- A15673-12
- A16365-19
- A16365-09
- A14162-31
- A10113-81
- SPK10-0.006-AC-1212
- 5591S 210 MM X 300 MM 2.5 MM
- TW12
- EYG-A060910P
- 5519S 210 MM X 155 MM X 0.5 MM
- SPK4-0.006-AC-97
- SP400-0.007-00-25
- Q3-0.005-00-25