Laird Technologies - Thermal Materials - A14566-01

KEY Part #: K6153186

A14566-01 Prezioak (USD) [925piezak Stock]

  • 1 pcs$50.41582
  • 4 pcs$50.16499

Taldea zenbakia:
A14566-01
fabrikatzailea:
Laird Technologies - Thermal Materials
Deskribapen zehatza:
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5120 9" x 9" x 0.120"
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Kuxinak, xaflak, Termikoa - Likidoak Hoztea, Modulu termikoak - Termoelektrikoak, Peltier, DC Zaleak, Termikoak - Bero-konketa, Zaleak - Osagarriak - Fan kableak, Zaleak and Termikoak - Itsasgarriak, epoxiak, koipeak, itsats ...
Abantaila lehiakorra:
We specialize in Laird Technologies - Thermal Materials A14566-01 electronic components. A14566-01 can be shipped within 24 hours after order. If you have any demands for A14566-01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A14566-01 Produktuen atributuak

Taldea zenbakia : A14566-01
fabrikatzailea : Laird Technologies - Thermal Materials
deskribapena : THERM PAD 228.6MMX228.6MM BLUE
Series : Tflex™ 500
Taldearen egoera : Not For New Designs
Usage : -
Mota : Gap Filler Pad, Sheet
forma : Square
eskema : 228.60mm x 228.60mm
Lodiera : 0.120" (3.05mm)
Material : Silicone Elastomer
Atxikidura : Tacky - Both Sides
Babeslea, garraiolaria : -
Kolore : Blue
Erresistentzia termikoa : -
Eroankortasun termikoa : 2.8 W/m-K

Era berean, interesatuko zaizu
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft