Parker Chomerics - 60-11-8302-1674

KEY Part #: K6153184

60-11-8302-1674 Prezioak (USD) [322487piezak Stock]

  • 1 pcs$0.11469

Taldea zenbakia:
60-11-8302-1674
fabrikatzailea:
Parker Chomerics
Deskribapen zehatza:
CHO-THERM 1674 TO-220 0.010.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Bero Hodiak, Lurrun Ganberak, Zaleak, Termikoak - Bero-konketa, Modulu termikoak - Termoelektrikoak, Peltier, Termikoak - Kuxinak, xaflak, Termikoak - Termoelektrikoak, Peltier multzoak, DC Zaleak and Termikoak - Itsasgarriak, epoxiak, koipeak, itsats ...
Abantaila lehiakorra:
We specialize in Parker Chomerics 60-11-8302-1674 electronic components. 60-11-8302-1674 can be shipped within 24 hours after order. If you have any demands for 60-11-8302-1674, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

60-11-8302-1674 Produktuen atributuak

Taldea zenbakia : 60-11-8302-1674
fabrikatzailea : Parker Chomerics
deskribapena : CHO-THERM 1674 TO-220 0.010
Series : CHO-THERM® 1674
Taldearen egoera : Active
Usage : TO-220
Mota : Insulator Pad, Sheet
forma : Rectangular
eskema : 18.03mm x 12.70mm
Lodiera : 0.0100" (0.254mm)
Material : Silicone
Atxikidura : -
Babeslea, garraiolaria : Fiberglass
Kolore : Blue
Erresistentzia termikoa : -
Eroankortasun termikoa : 1.0 W/m-K
Era berean, interesatuko zaizu
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft