Advanced Thermal Solutions Inc. - ATS-P1-15-C2-R0

KEY Part #: K6263921

ATS-P1-15-C2-R0 Prezioak (USD) [14343piezak Stock]

  • 1 pcs$2.70149
  • 10 pcs$2.62789
  • 25 pcs$2.48185
  • 50 pcs$2.33589
  • 100 pcs$2.18993
  • 250 pcs$2.04393
  • 500 pcs$1.89794
  • 1,000 pcs$1.86144

Taldea zenbakia:
ATS-P1-15-C2-R0
fabrikatzailea:
Advanced Thermal Solutions Inc.
Deskribapen zehatza:
HEATSINK 50X50X25MM XCUT T766.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Bero-konketa, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Zaleak - Osagarriak - Fan kableak, DC Zaleak, Termikoa - Likidoak Hoztea, Termikoak - Bero Hodiak, Lurrun Ganberak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats and Termikoak - Kuxinak, xaflak ...
Abantaila lehiakorra:
We specialize in Advanced Thermal Solutions Inc. ATS-P1-15-C2-R0 electronic components. ATS-P1-15-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-P1-15-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-P1-15-C2-R0 Produktuen atributuak

Taldea zenbakia : ATS-P1-15-C2-R0
fabrikatzailea : Advanced Thermal Solutions Inc.
deskribapena : HEATSINK 50X50X25MM XCUT T766
Series : pushPIN™
Taldearen egoera : Active
Mota : Top Mount
Paketea hoztu da : Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa : Push Pin
forma : Square, Fins
Luzera : 1.969" (50.00mm)
Zabalera : 1.969" (50.00mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 0.984" (25.00mm)
Potentzia xahutzea @ tenperatura igoera : -
Erresistentzia termikoa @ Aire Fluxu behartua : 7.44°C/W @ 100 LFM
Erresistentzia termikoa @ Naturala : -
Material : Aluminum
Materialaren akabera : Blue Anodized

Era berean, interesatuko zaizu
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.