t-Global Technology - DC0025/01-H48-6G-0.3-2A

KEY Part #: K6153149

DC0025/01-H48-6G-0.3-2A Prezioak (USD) [40137piezak Stock]

  • 1 pcs$0.97417
  • 10 pcs$0.94909
  • 25 pcs$0.92350
  • 50 pcs$0.87224
  • 100 pcs$0.82094
  • 250 pcs$0.76964
  • 500 pcs$0.74398
  • 1,000 pcs$0.66702
  • 5,000 pcs$0.65419

Taldea zenbakia:
DC0025/01-H48-6G-0.3-2A
fabrikatzailea:
t-Global Technology
Deskribapen zehatza:
THERM PAD 36.83MMX21.29MM W/ADH.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Zaleak, Termikoa - Likidoak Hoztea, Termikoa - Osagarriak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Kuxinak, xaflak, Modulu termikoak - Termoelektrikoak, Peltier, Zaleak - Osagarriak - Fan kableak and Termikoak - Bero-konketa ...
Abantaila lehiakorra:
We specialize in t-Global Technology DC0025/01-H48-6G-0.3-2A electronic components. DC0025/01-H48-6G-0.3-2A can be shipped within 24 hours after order. If you have any demands for DC0025/01-H48-6G-0.3-2A, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DC0025/01-H48-6G-0.3-2A Produktuen atributuak

Taldea zenbakia : DC0025/01-H48-6G-0.3-2A
fabrikatzailea : t-Global Technology
deskribapena : THERM PAD 36.83MMX21.29MM W/ADH
Series : H48-6G
Taldearen egoera : Active
Usage : SIP
Mota : Die-Cut Pad, Sheet
forma : Rectangular
eskema : 36.83mm x 21.29mm
Lodiera : 0.0120" (0.305mm)
Material : Silicone Elastomer
Atxikidura : Adhesive - Both Sides
Babeslea, garraiolaria : -
Kolore : Gray
Erresistentzia termikoa : -
Eroankortasun termikoa : 6.0 W/m-K

Era berean, interesatuko zaizu
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole