Advanced Thermal Solutions Inc. - ATS-H1-168-C2-R0

KEY Part #: K6263769

ATS-H1-168-C2-R0 Prezioak (USD) [10861piezak Stock]

  • 1 pcs$3.56526
  • 10 pcs$3.46919
  • 25 pcs$3.27652
  • 50 pcs$3.08367
  • 100 pcs$2.89099
  • 250 pcs$2.69825
  • 500 pcs$2.50551
  • 1,000 pcs$2.45733

Taldea zenbakia:
ATS-H1-168-C2-R0
fabrikatzailea:
Advanced Thermal Solutions Inc.
Deskribapen zehatza:
HEATSINK 25X25X25MM R-TAB T766.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoa - Likidoak Hoztea, Termikoak - Kuxinak, xaflak, DC Zaleak, Zaleak, Zaleak - Osagarriak - Fan kableak, Termikoak - Bero-konketa, Termikoak - Termoelektrikoak, Peltier multzoak and Zaleak - Osagarriak ...
Abantaila lehiakorra:
We specialize in Advanced Thermal Solutions Inc. ATS-H1-168-C2-R0 electronic components. ATS-H1-168-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-168-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-H1-168-C2-R0 Produktuen atributuak

Taldea zenbakia : ATS-H1-168-C2-R0
fabrikatzailea : Advanced Thermal Solutions Inc.
deskribapena : HEATSINK 25X25X25MM R-TAB T766
Series : pushPIN™
Taldearen egoera : Active
Mota : Top Mount
Paketea hoztu da : Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa : Push Pin
forma : Square, Fins
Luzera : 0.984" (25.00mm)
Zabalera : 0.984" (25.00mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 0.984" (25.00mm)
Potentzia xahutzea @ tenperatura igoera : -
Erresistentzia termikoa @ Aire Fluxu behartua : 7.01°C/W @ 100 LFM
Erresistentzia termikoa @ Naturala : -
Material : Aluminum
Materialaren akabera : Blue Anodized

Era berean, interesatuko zaizu
  • 510-6U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 187.452x152.4mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • 122258

    Wakefield-Vette

    HEATSINK 15817 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 15817, 12x7.38x3.1 Inch

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-76.2-25.4-0.07-1A

    t-Global Technology

    PH3N NANO 76.2X25.4X0.07MM.