ATS-X53270P-C1-R0 Prezioak (USD) [5349piezak Stock]
- 1 pcs$8.48302
- 10 pcs$7.61970
- 25 pcs$7.17160
- 50 pcs$6.72332
- 100 pcs$6.27513
- 250 pcs$5.82690
- 500 pcs$5.71484
- Taldea zenbakia:
- ATS-X53270P-C1-R0
- fabrikatzailea:
- Advanced Thermal Solutions Inc.
- Deskribapen zehatza:
- SUPERGRIP HEATSINK 27X27X17.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 27x27x17.5mm
- Fabrikatzailearen denbora beruna:
- Badago
- Bizimodua:
- Urte bat
- Chip From:
- Hong Kong
- RoHS:
- Ordaintzeko modua:
-
- Bidalketa modua:
- Familia Kategoriak:
- KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoa - Osagarriak, Termikoak - Kuxinak, xaflak, Termikoa - Likidoak Hoztea, Termikoak - Bero-konketa, Termikoak - Bero Hodiak, Lurrun Ganberak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Termoelektrikoak, Peltier multzoak and Zaleak ...
- Abantaila lehiakorra:
- We specialize in Advanced Thermal Solutions Inc. ATS-X53270P-C1-R0 electronic components. ATS-X53270P-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53270P-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-X53270P-C1-R0 Produktuen atributuak
Taldea zenbakia :
ATS-X53270P-C1-R0
fabrikatzailea :
Advanced Thermal Solutions Inc.
deskribapena :
SUPERGRIP HEATSINK 27X27X17.5MM
Series :
superGRIP™
Taldearen egoera :
Active
Mota :
Top Mount
Paketea hoztu da :
BGA
Eranskineko metodoa :
Clip, Thermal Material
forma :
Square, Fins
Luzera :
1.063" (27.00mm)
Zabalera :
1.063" (27.00mm)
diametroa :
-
Altuera Itxi Oinarria (Altueraren altuera) :
0.689" (17.50mm)
Potentzia xahutzea @ tenperatura igoera :
-
Erresistentzia termikoa @ Aire Fluxu behartua :
5.30°C/W @ 200 LFM
Erresistentzia termikoa @ Naturala :
-
Material :
Aluminum
Materialaren akabera :
Blue Anodized
Azken berriak
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