Aavid, Thermal Division of Boyd Corporation - 505303B00000G

KEY Part #: K6234674

505303B00000G Prezioak (USD) [36442piezak Stock]

  • 1 pcs$1.21614
  • 3,000 pcs$1.21009

Taldea zenbakia:
505303B00000G
fabrikatzailea:
Aavid, Thermal Division of Boyd Corporation
Deskribapen zehatza:
BOARD LEVEL HEAT SINK. Heat Sinks Square Basket Style Board Level Heatsink for TO-3, Straight Fins, Horizontal Mounting, 7.8 n Thermal Resistance, Black Anodized, 25.4mm
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Termoelektrikoak, Peltier multzoak, Zaleak, Termikoa - Likidoak Hoztea, Zaleak - Osagarriak, Modulu termikoak - Termoelektrikoak, Peltier, DC Zaleak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats and Termikoak - Bero Hodiak, Lurrun Ganberak ...
Abantaila lehiakorra:
We specialize in Aavid, Thermal Division of Boyd Corporation 505303B00000G electronic components. 505303B00000G can be shipped within 24 hours after order. If you have any demands for 505303B00000G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

505303B00000G Produktuen atributuak

Taldea zenbakia : 505303B00000G
fabrikatzailea : Aavid, Thermal Division of Boyd Corporation
deskribapena : BOARD LEVEL HEAT SINK
Series : -
Taldearen egoera : Active
Mota : Board Level
Paketea hoztu da : TO-3
Eranskineko metodoa : Bolt On
forma : Square, Pin Fins
Luzera : 1.780" (45.21mm)
Zabalera : 1.780" (45.21mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 1.000" (25.40mm)
Potentzia xahutzea @ tenperatura igoera : 4.0W @ 30°C
Erresistentzia termikoa @ Aire Fluxu behartua : 3.00°C/W @ 200 LFM
Erresistentzia termikoa @ Naturala : 7.80°C/W
Material : Aluminum
Materialaren akabera : Black Anodized

Era berean, interesatuko zaizu
  • 511-3M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x76.2mm

  • 1-1542002-1

    TE Connectivity AMP Connectors

    HEAT SINK BGA 37.5MM 2FIN RADIAL. Heat Sinks 2 Fin Radial 37.5 x 37.5

  • PH3N-101.6-25.4-0.062-1A

    t-Global Technology

    PH3N NANO 101.6X25.4X0.062MM.

  • AH50600V05000FE

    Ohmite

    ALUMINUM EXTRUSION 5. Heat Sinks Alum Extrusion 5" For HS100 Series

  • C264-085-3VE

    Ohmite

    HEATSINK AND CLIPS FOR 3 TO-264. Heat Sinks HEATSINK FOR TO-264 3 CLIPS, NO FINISH

  • 576203B00000G

    Aavid, Thermal Division of Boyd Corporation

    BOARD LEVEL HEAT SINK. Heat Sinks Square Basket Style Board Level Heatsink for TO-3, Slanted Vane Fins, Horizontal Mounting, 6.2 n Thermal Resistance, Black Anodized, 19.05mm