[8725piezak Stock]
- Taldea zenbakia:
- APF19-19-13CB
- fabrikatzailea:
- CTS Thermal Management Products
- Deskribapen zehatza:
- HEATSINK LOW-PROFILE FORGED.
- Fabrikatzailearen denbora beruna:
- Badago
- Bizimodua:
- Urte bat
- Chip From:
- Hong Kong
- RoHS:
- Ordaintzeko modua:
-
- Bidalketa modua:
- Familia Kategoriak:
- KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Kuxinak, xaflak, Termikoak - Bero Hodiak, Lurrun Ganberak, Modulu termikoak - Termoelektrikoak, Peltier, Termikoa - Likidoak Hoztea, Zaleak, Termikoak - Bero-konketa, DC Zaleak and Termikoak - Termoelektrikoak, Peltier multzoak ...
- Abantaila lehiakorra:
- We specialize in CTS Thermal Management Products APF19-19-13CB electronic components. APF19-19-13CB can be shipped within 24 hours after order. If you have any demands for APF19-19-13CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
APF19-19-13CB Produktuen atributuak
Taldea zenbakia :
APF19-19-13CB
fabrikatzailea :
CTS Thermal Management Products
deskribapena :
HEATSINK LOW-PROFILE FORGED
Series :
APF
Taldearen egoera :
Active
Mota :
Top Mount
Paketea hoztu da :
Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa :
Thermal Tape, Adhesive (Not Included)
forma :
Square, Fins
Luzera :
0.748" (19.00mm)
Zabalera :
0.748" (19.00mm)
diametroa :
-
Altuera Itxi Oinarria (Altueraren altuera) :
0.500" (12.70mm)
Potentzia xahutzea @ tenperatura igoera :
-
Erresistentzia termikoa @ Aire Fluxu behartua :
4.00°C/W @ 200 LFM
Erresistentzia termikoa @ Naturala :
-
Material :
Aluminum
Materialaren akabera :
Black Anodized
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