Parker Chomerics - 60-12-4997-1674

KEY Part #: K6153131

60-12-4997-1674 Prezioak (USD) [114050piezak Stock]

  • 1 pcs$0.32431

Taldea zenbakia:
60-12-4997-1674
fabrikatzailea:
Parker Chomerics
Deskribapen zehatza:
CHO-THERM 1674 TO-66 0.010 ADH.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: DC Zaleak, Modulu termikoak - Termoelektrikoak, Peltier, Termikoa - Osagarriak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Bero-konketa, Zaleak, Zaleak - Osagarriak - Fan kableak and Termikoak - Itsasgarriak, epoxiak, koipeak, itsats ...
Abantaila lehiakorra:
We specialize in Parker Chomerics 60-12-4997-1674 electronic components. 60-12-4997-1674 can be shipped within 24 hours after order. If you have any demands for 60-12-4997-1674, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

60-12-4997-1674 Produktuen atributuak

Taldea zenbakia : 60-12-4997-1674
fabrikatzailea : Parker Chomerics
deskribapena : CHO-THERM 1674 TO-66 0.010 ADH
Series : CHO-THERM® 1674
Taldearen egoera : Active
Usage : TO-66
Mota : Insulator Pad, Sheet
forma : Rhombus
eskema : 34.93mm x 20.96mm
Lodiera : 0.0100" (0.254mm)
Material : -
Atxikidura : Adhesive - One Side
Babeslea, garraiolaria : Fiberglass
Kolore : Blue
Erresistentzia termikoa : -
Eroankortasun termikoa : 1.0 W/m-K
Era berean, interesatuko zaizu
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole