t-Global Technology - TG6050-54-10-2

KEY Part #: K6153188

TG6050-54-10-2 Prezioak (USD) [47232piezak Stock]

  • 1 pcs$0.82784
  • 10 pcs$0.80442
  • 25 pcs$0.78268
  • 50 pcs$0.73920
  • 100 pcs$0.69572
  • 250 pcs$0.65224
  • 500 pcs$0.63049
  • 1,000 pcs$0.56527
  • 5,000 pcs$0.55440

Taldea zenbakia:
TG6050-54-10-2
fabrikatzailea:
t-Global Technology
Deskribapen zehatza:
THERM PAD 54MMX10MM RED.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Kuxinak, xaflak, Modulu termikoak - Termoelektrikoak, Peltier, Termikoa - Osagarriak, Zaleak - Osagarriak, Termikoa - Likidoak Hoztea, Zaleak and Termikoak - Termoelektrikoak, Peltier multzoak ...
Abantaila lehiakorra:
We specialize in t-Global Technology TG6050-54-10-2 electronic components. TG6050-54-10-2 can be shipped within 24 hours after order. If you have any demands for TG6050-54-10-2, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TG6050-54-10-2 Produktuen atributuak

Taldea zenbakia : TG6050-54-10-2
fabrikatzailea : t-Global Technology
deskribapena : THERM PAD 54MMX10MM RED
Series : TG6050
Taldearen egoera : Active
Usage : -
Mota : Conductive Pad, Sheet
forma : Rectangular
eskema : 54.00mm x 10.00mm
Lodiera : 0.0790" (2.000mm)
Material : Silicone Elastomer
Atxikidura : Tacky - Both Sides
Babeslea, garraiolaria : -
Kolore : Red
Erresistentzia termikoa : -
Eroankortasun termikoa : 6.0 W/m-K

Era berean, interesatuko zaizu
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft