Advanced Thermal Solutions Inc. - ATS-X53170P-C1-R0

KEY Part #: K6263926

ATS-X53170P-C1-R0 Prezioak (USD) [5330piezak Stock]

  • 1 pcs$7.67699
  • 10 pcs$7.24907
  • 25 pcs$6.82256
  • 50 pcs$6.39623
  • 100 pcs$5.96977
  • 250 pcs$5.54337
  • 500 pcs$5.43676

Taldea zenbakia:
ATS-X53170P-C1-R0
fabrikatzailea:
Advanced Thermal Solutions Inc.
Deskribapen zehatza:
SUPERGRIP HEATSINK 17X17X17.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 17x17x17.5mm
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Zaleak - Osagarriak - Fan kableak, Zaleak - Osagarriak, Zaleak, Termikoak - Bero-konketa, Termikoa - Osagarriak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, DC Zaleak and Modulu termikoak - Termoelektrikoak, Peltier ...
Abantaila lehiakorra:
We specialize in Advanced Thermal Solutions Inc. ATS-X53170P-C1-R0 electronic components. ATS-X53170P-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53170P-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-X53170P-C1-R0 Produktuen atributuak

Taldea zenbakia : ATS-X53170P-C1-R0
fabrikatzailea : Advanced Thermal Solutions Inc.
deskribapena : SUPERGRIP HEATSINK 17X17X17.5MM
Series : superGRIP™
Taldearen egoera : Active
Mota : Top Mount
Paketea hoztu da : BGA
Eranskineko metodoa : Clip, Thermal Material
forma : Square, Fins
Luzera : 0.669" (17.00mm)
Zabalera : 0.669" (17.00mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 0.689" (17.50mm)
Potentzia xahutzea @ tenperatura igoera : -
Erresistentzia termikoa @ Aire Fluxu behartua : 9.30°C/W @ 200 LFM
Erresistentzia termikoa @ Naturala : -
Material : Aluminum
Materialaren akabera : Blue Anodized

Era berean, interesatuko zaizu
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • 122259

    Wakefield-Vette

    HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.