t-Global Technology - H48-2K-20-20-0.1

KEY Part #: K6153047

H48-2K-20-20-0.1 Prezioak (USD) [623475piezak Stock]

  • 1 pcs$0.05932
  • 10 pcs$0.05774
  • 25 pcs$0.05474
  • 50 pcs$0.05323
  • 100 pcs$0.05256
  • 250 pcs$0.04895
  • 500 pcs$0.04607
  • 1,000 pcs$0.04175
  • 5,000 pcs$0.04031

Taldea zenbakia:
H48-2K-20-20-0.1
fabrikatzailea:
t-Global Technology
Deskribapen zehatza:
THERM PAD 20MMX20MM RED.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoa - Likidoak Hoztea, Modulu termikoak - Termoelektrikoak, Peltier, Zaleak - Osagarriak - Fan kableak, Termikoak - Itsasgarriak, epoxiak, koipeak, itsats, Termikoak - Kuxinak, xaflak, DC Zaleak, Termikoa - Osagarriak and Zaleak - Osagarriak ...
Abantaila lehiakorra:
We specialize in t-Global Technology H48-2K-20-20-0.1 electronic components. H48-2K-20-20-0.1 can be shipped within 24 hours after order. If you have any demands for H48-2K-20-20-0.1, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

H48-2K-20-20-0.1 Produktuen atributuak

Taldea zenbakia : H48-2K-20-20-0.1
fabrikatzailea : t-Global Technology
deskribapena : THERM PAD 20MMX20MM RED
Series : H48-2K
Taldearen egoera : Active
Usage : -
Mota : Conductive Pad, Sheet
forma : Square
eskema : 20.00mm x 20.00mm
Lodiera : 0.0039" (0.100mm)
Material : Silicone
Atxikidura : -
Babeslea, garraiolaria : -
Kolore : Red
Erresistentzia termikoa : -
Eroankortasun termikoa : 1.8 W/m-K

Era berean, interesatuko zaizu
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick