ATS-FPX030030025-52-C2-R0 Prezioak (USD) [23857piezak Stock]
- 1 pcs$1.62178
- 10 pcs$1.58123
- 25 pcs$1.53822
- 50 pcs$1.45281
- 100 pcs$1.36736
- 250 pcs$1.28191
- 500 pcs$1.23918
- 1,000 pcs$1.05401
- Taldea zenbakia:
- ATS-FPX030030025-52-C2-R0
- fabrikatzailea:
- Advanced Thermal Solutions Inc.
- Deskribapen zehatza:
- HEATSINK 30X30X25MM L-TAB FP.
- Fabrikatzailearen denbora beruna:
- Badago
- Bizimodua:
- Urte bat
- Chip From:
- Hong Kong
- RoHS:
- Ordaintzeko modua:
-
- Bidalketa modua:
- Familia Kategoriak:
- KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: Termikoak - Bero Hodiak, Lurrun Ganberak, Termikoak - Kuxinak, xaflak, Termikoa - Likidoak Hoztea, Zaleak - Osagarriak - Fan kableak, Termikoak - Bero-konketa, Zaleak, DC Zaleak and Termikoak - Itsasgarriak, epoxiak, koipeak, itsats ...
- Abantaila lehiakorra:
- We specialize in Advanced Thermal Solutions Inc. ATS-FPX030030025-52-C2-R0 electronic components. ATS-FPX030030025-52-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-FPX030030025-52-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-FPX030030025-52-C2-R0 Produktuen atributuak
Taldea zenbakia :
ATS-FPX030030025-52-C2-R0
fabrikatzailea :
Advanced Thermal Solutions Inc.
deskribapena :
HEATSINK 30X30X25MM L-TAB FP
Series :
pushPIN™
Taldearen egoera :
Active
Mota :
Top Mount
Paketea hoztu da :
Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa :
Push Pin
forma :
Square, Fins
Luzera :
1.181" (30.00mm)
Zabalera :
1.181" (30.00mm)
diametroa :
-
Altuera Itxi Oinarria (Altueraren altuera) :
0.984" (25.00mm)
Potentzia xahutzea @ tenperatura igoera :
-
Erresistentzia termikoa @ Aire Fluxu behartua :
10.79°C/W @ 100 LFM
Erresistentzia termikoa @ Naturala :
-
Material :
Aluminum
Materialaren akabera :
Blue Anodized
Azken berriak
Era berean, interesatuko zaizu
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
Pieza beroak
- LATO3B4B
- 565415-01
- 565019-01
- FEX35-35-21/T710/M2
- DA-T268-301E
- 4-1542005-5
- 7-1542004-0
- 8-1542003-7
- 574802B03700G
- VHS-95
- MHST02525
- MHSL05025
- MHSL05040
- APR38-38-12CB
- 7-438-X44-BA
- 243-3PAB
- LA363B5CB
- LA363B4CB
- 7-406-000-BA
- 7-300-000-BA
- 7-192-BA
- 2-1963559-7
- 2-1963562-3
- 2-1963556-7
- 2-1963559-2
- 1-1963558-2
- 2-1963555-2
- 1-1963555-2
- 2-1963557-5
- 1-1963559-5
- 2-1963553-4
- 2-1963555-3
- 2-1963551-3
- 1-1963553-3
- 5-1542006-7
- 39880100030
- 39880100110
- 39880100060
- 39880100040
- 7-1542006-0