Advanced Thermal Solutions Inc. - ATS-P2-34-C2-R0

KEY Part #: K6264028

ATS-P2-34-C2-R0 Prezioak (USD) [9079piezak Stock]

  • 1 pcs$4.26598
  • 10 pcs$4.15007
  • 25 pcs$3.91959
  • 50 pcs$3.68901
  • 100 pcs$3.45848
  • 250 pcs$3.22792
  • 500 pcs$2.99735
  • 1,000 pcs$2.93971

Taldea zenbakia:
ATS-P2-34-C2-R0
fabrikatzailea:
Advanced Thermal Solutions Inc.
Deskribapen zehatza:
HEATSINK 57.9X36.83X22.86MM T766.
Fabrikatzailearen denbora beruna:
Badago
Bizimodua:
Urte bat
Chip From:
Hong Kong
RoHS:
Ordaintzeko modua:
Bidalketa modua:
Familia Kategoriak:
KEY Components Co., LTD. Osagaien banatzaile elektronikoa da. Produktuen kategoria eskaintzen du: DC Zaleak, Termikoak - Bero Hodiak, Lurrun Ganberak, Modulu termikoak - Termoelektrikoak, Peltier, Termikoak - Termoelektrikoak, Peltier multzoak, Termikoa - Osagarriak, Zaleak, Zaleak - Osagarriak and Zaleak - Osagarriak - Fan kableak ...
Abantaila lehiakorra:
We specialize in Advanced Thermal Solutions Inc. ATS-P2-34-C2-R0 electronic components. ATS-P2-34-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-P2-34-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-P2-34-C2-R0 Produktuen atributuak

Taldea zenbakia : ATS-P2-34-C2-R0
fabrikatzailea : Advanced Thermal Solutions Inc.
deskribapena : HEATSINK 57.9X36.83X22.86MM T766
Series : pushPIN™
Taldearen egoera : Active
Mota : Top Mount
Paketea hoztu da : Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa : Push Pin
forma : Rectangular, Fins
Luzera : 2.280" (57.90mm)
Zabalera : 1.450" (36.83mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 0.900" (22.86mm)
Potentzia xahutzea @ tenperatura igoera : -
Erresistentzia termikoa @ Aire Fluxu behartua : 14.33°C/W @ 100 LFM
Erresistentzia termikoa @ Naturala : -
Material : Aluminum
Materialaren akabera : Blue Anodized

Era berean, interesatuko zaizu
  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-2AB

    Wakefield-Vette

    HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes

  • 122259

    Wakefield-Vette

    HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio

  • TG-CJ-LI-32-32-6-PF

    t-Global Technology

    HEATSINK CER 32X32X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.

  • TG-CJ-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM.